Description:
Reference #: 00465
The University of South Carolina is offering licensing opportunities for this technology
Invention Description:
This novel invention involves both a method and apparatus for the slicing of ingots, particularly silicon carbide (SiC) and hard brittle materials. The cutting machine provides a high cutting speed of the ingot.
Advantages and Benefits:
There are many advantages to this technology, including the following:
(1) the wafers produced by this method exhibit low total thickness variation and low depth of surface damage;
(2) the proposed method is a single step process as opposed to current two-step process;
(3) the surface after slicing is ready for polishing - no lapping step is required;
(4) the system is easy to use and is simple in design; and
(5) multiple crystals may be cut simultaneously
Potential Applications:
This method of slicing hard, brittle materials produces cuts from a bulk material, or wafers, from hard semiconductor ingots as well as other crystalline and ceramic materials.