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Methods and Integrated Structures of Heat Dissipation for Microwave Antennas

Reference #: 01445 The University of South Carolina is offering licensing opportunities for Methods and Integrated Structures of Heat Dissipation for Microwave Antennas Background: With the significant growth in mobile traffic and number of wireless communication standards, 5G mobile networks are rapidly developed which are forecast to have a larger...

Published: 6/6/2023 | Inventor(s): Guoan Wang, Jinqun Ge, Sanjib Sur, Srihari Nelakuditi

Keywords(s): heat sink, integrated structure, microwave antenna, reconfigurable, Thermal dissipation

Category(s): Engineering and Physical Sciences

Method and Design of High-Performance Interconnects with Improved Signal Integrity

Reference #: 01444 The University of South Carolina is offering licensing opportunities for Method and Design of High-Performance Interconnects with Improved Signal Integrity Background: Over the last few decades, there has been a progressively expanded tendency of increasing trace density on printed circuit boards (PCBs) and silicon dies in the...

Published: 7/18/2023 | Inventor(s): Guoan Wang, Jinqun Ge

Keywords(s): capacitive coupling, dielectric material, Far-end crosstalk (FEXT), interconnect, interdigital trapezoidal tabs, magnetic coupling, magnetic material

Category(s): Engineering and Physical Sciences