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Methods and Integrated Structures of Heat Dissipation for Microwave Antennas
Reference #: 01445 The University of South Carolina is offering licensing opportunities for Methods and Integrated Structures of Heat Dissipation for Microwave Antennas Background: With the significant growth in mobile traffic and number of wireless communication standards, 5G mobile networks are rapidly developed which are forecast to have a larger...
Published: 6/6/2023   |   Inventor(s): Guoan Wang, Jinqun Ge, Sanjib Sur, Srihari Nelakuditi
Keywords(s): heat sink, integrated structure, microwave antenna, reconfigurable, Thermal dissipation
Category(s): Engineering and Physical Sciences
Method and Design of High-Performance Interconnects with Improved Signal Integrity
Reference #: 01444 The University of South Carolina is offering licensing opportunities for Method and Design of High-Performance Interconnects with Improved Signal Integrity Background: Over the last few decades, there has been a progressively expanded tendency of increasing trace density on printed circuit boards (PCBs) and silicon dies in the...
Published: 7/18/2023   |   Inventor(s): Guoan Wang, Jinqun Ge
Keywords(s): capacitive coupling, dielectric material, Far-end crosstalk (FEXT), interconnect, interdigital trapezoidal tabs, magnetic coupling, magnetic material
Category(s): Engineering and Physical Sciences
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